IWSDA'17 Committee

General Co-Chairs

Pingzhi Fan, Southwest Jiaotong University, China
Tetsuya Kojima, NIT, Tokyo College, Japan

General Secretary

Takahiro Matsumoto, Yamaguchi University, Japan

Technical Program Co-Chairs

Hideyuki Torii, Kanagawa Inst. of Technology, Japan
Xiaohu Tang, Southwest Jiaotong University, China
Udaya Parampalli, The Univ. of Melbourne, Australia

Technical Program Committee

Serdar Boztas, RMIT University, Australia
Claude Carlet, INRIA, France
Chi-Chao Chao, National Tsing Hua University, Taiwan
Qingchun Chen, Southwest Jiaotong University, China
Cunsheng Ding, HKUST, Hong Kong
Guang Gong, University of Waterloo, Canada
Hiromasa Habuchi, Ibaraki University, Japan
Chenggao Han, Univ. of Electro-Communications, Japan
Yunghsiang S. Han, NTUST, Taiwan
Li Hao, Southwest Jiaotong University, China
Tor Helleseth, University of Bergen, Norway
Honggang Hu, University of Science and Tech., China
Kwang Soon Kim, Yonsei University, Korea
Andrew Klapper, University of Kentucky, USA
Hsiao-feng Lu, National Chiao Tung University, Taiwan
Subhamoy Maitra, Indian Statistical Institute, India
Shinya Matsufuji, Yamaguchi University, Japan
Yoshikazu Miyanaga, Hokkaido University, Japan
Wai Ho Mow, HKUST, Hong Kong
Alexander Pott, Otto-von-Guericke-Univ., Germany
Dong-Joon Shin, Hanyang University, Korea
Patrick Sole, CNRS-I3S, France
Hong-Yeop Song, Yonsei University, Korea
Srinivas Talabattula, Indian Institute of Science, India
Satoshi Uehara, University of Kitakyushu, Japan
Dianhua Wu, Guangxi Normal University, China
Kyeongcheol Yang, POSTECH, Korea
Xiangyong Zeng, Hubei University, China
Junru Zheng, Kyushu Women's University, Japan
Zhengchun Zhou, Southwest Jiaotong University, China

Publication

Shunsuke Araki, Kyushu Institute of Technology, Japan

Finance

Takeru Miyazaki, University of Kitakyushu, Japan

Publicity

Yuta Ida, Yamaguchi University, Japan

Local Arrangement

Naofumi Aoki, Hokkaido University, Japan

IWSDA'17 is planned to be supported by the following technical sponsors (pending approval). IEEE (USA), IEEE Sapporo Section (Japan), Engineering Sciences Society of IEICE (Japan), Hokkaido University (Japan), National Institute of Technology, Tokyo College (Japan), Yamaguchi University (Japan), Southwest Jiaotong University (China), the Murata Science Foundation.